Google's pixel 11 pro xl: early case hints at design changes and upgrades

A render of a phone case for the upcoming Google Pixel 11 Pro XL may have inadvertently revealed some design changes and upgrades the company has planned for its flagship device.

Case leak suggests wider rear camera cutout and thinner camera bar

A Texas-based case manufacturer called ThinBorne has listed a Pixel 11 Pro XL case on its website, complete with images of the product. This early look at the accessory could provide clues about the design of the phone itself.

According to the case render, the Pixel 11 Pro XL may feature a slightly larger rear camera cutout compared to its predecessors, indicating a wider camera bar. Additionally, the camera bump on the case appears less pronounced, implying that the actual phone will have a thinner rear camera housing.

Tensor g6 processor with 2nm gate-all-around transistors expected

Speculation suggests the Pixel 11 Pro XL will be powered by Google's next-generation Tensor G6 processor, built using TSMC's 2nm process node with Gate-All-Around (GAA) transistors.

GAA transistors help improve the processor's performance while reducing power consumption by up to 25-30% compared to the previous 3nm N3E node used in the Tensor G5.

Improved 5g connectivity and face unlock

Leaks indicate the Pixel 11 Pro XL will feature the more reliable MediaTek M90 5G modem, a significant upgrade over the Samsung Exynos 5123 modem found in the Pixel 6 Pro.

Google's Project Toscana could also introduce infrared integration to the phone's Face Unlock feature, potentially elevating it to match the level of Apple's Face ID.

Other rumored upgrades include the replacement of the optical fingerprint scanner with an ultrasonic one and improved connectivity overall.

While these details have yet to be officially confirmed by Google, the early case leak provides intriguing hints at the company's plans for its next flagship device.